From 800G/1.6T optical transceivers to automotive LiDAR, our InP substrates and epitaxial materials serve advanced compound semiconductor applications including optical transceivers, co-packaged optics, silicon photonics, high-speed lasers and photodetectors, 5G and telecom infrastructure, and autonomous driving sensing.
Six core scenarios covering the downstream markets with the highest current demand for InP materials.
High-speed optical transceivers for AI data centers (800G/1.6T), long-haul fiber transmission, and 5G/6G optical fronthaul; used in DFB lasers, EML modulated lasers, photodetectors, and photonic integrated circuits (PIC), compatible with 1310/1550nm fiber communication windows.
CPO solutions for AI compute clusters, co-packaging InP lasers with silicon photonic engines to significantly reduce power consumption and latency; we supply high-power CW light sources, external laser sources (ELS), and InP gain chips for optical engines, compatible with 800G/1.6T and next-gen 3.2T optical interconnects.
III-V material integration solutions for silicon photonics platforms: InP light source chips are combined with silicon photonic waveguides through wafer-level bonding and heterogeneous integration, serving transceiver transmitters, optical interconnects, and optical computing; epi wafers and bonding substrates are available with volume-grade consistency.
DFB/EML lasers and UTC/APD photodetectors for 100G/200G/400G per-channel rates; InP substrates and epi structures can be customized by wavelength (1310/1550nm) and data rate to meet low-chirp, high-bandwidth, and low-dark-current requirements.
InP HEMT/HBT high-frequency transistors with low noise and high electron mobility; used in 5G/6G base station RF front ends, backbone and metro fiber-optic networks, passive optical networks (PON), and satellite and microwave communications, with excellent radiation hardness for space environments.
Focused on 1550nm eye-safe automotive LiDAR, covering ranging, single-photon detection, and SWIR imaging; the mainstream substrate solution for high-end LiDAR light source and receiver chips, supporting L3+ autonomous driving perception systems.
Typical scenarios broken down by the six application areas, helping you quickly identify material specifications and matching solutions.
Our technical team can match substrate and epitaxial solutions to your specific application and provide sample support.
